Senior Process Engineer – Chip Packaging

The position

As a Senior Process Engineer, you work at the intersection of packaging design, process development, materials science and semiconductor assembly technologies. You are actively involved in the entire development cycle of advanced die attach solutions and new packages for power electronics, from design and realization to experimental validation and characterization. You collaborate directly with industrial partners and customers to translate technology concepts into manufacturable products. You lead the design and experimental work in multiple customer and internal research projects and are part of a multidisciplinary and international team.

Key responsibilities:

• Defining and optimizing assembly processes and production flows for new die attach technologies, including developing processes for thin die assembly (50 μm and smaller)
• Designing packages and packaging components for power electronics, e.g. lead frames and clips
• Designing tooling for packaging manufacturing and assembly, including lead frame tooling, vacuum pick-up tools and other product-specific fixtures
• Setting up, executing and analysing Design of Experiments (DoE) for materials and process development
• Analysing experimental results and translating findings into process improvements and technological recommendations
• Programming and operating advanced packaging and assembly equipment
• Reporting technical progress and results to customers and project stakeholders
• Technical supervision of students and junior engineers

About the company

The organization is the Netherlands Organisation for Applied Scientific Research. As an independent research institute, they connect science and industry to accelerate innovation and translate knowledge into practical, scalable solutions. By combining in-depth technical expertise with a strong application focus, they supports companies and governments in addressing complex technological and societal challenges. Within the semiconductor sector, the company plays a leading role in the development of advanced chip packaging technologies through Chip Integration Technology Center (CITC). Under the CITC brand, TNO collaborates with industry leaders, materials suppliers, and equipment manufacturers to strengthen Europe’s position in semiconductor packaging and enable the next generation of high-performance electronic systems.

Through its innovation programs, the organization develops and scales innovative die attach and assembly technologies to improve the performance and reliability of power electronics. This work is carried out in the back-end laboratory in Nijmegen, which is equipped with state-of-the-art packaging and assembly equipment.

About you

You bring:

• Minimum of 8 years of experience in semiconductor packaging development
• Extensive knowledge of semiconductor assembly and packaging technologies
• Experience with packaging and tooling design using 2D and 3D design software like AutoCAD and/or SolidWorks
• Proven experience with DoE methodologies, data analysis, and experimental process development
• Experience with advanced assembly, die attach and interconnection technologies
• Knowledge of Ag and Cu sintering processes is highly desirable
• A hands-on mentality and the ability to independently plan and execute technical work
• Strong communication skills and the ability to present technical results in English to industrial customers and partners