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A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem. An in-depth understanding Analog and digital circuits are required. The devices analysed include new designs/products, low yield on existing products, qualification failures, and returns from customers.
The successful candidate will reproduce electrical failures in a lab environment and locate/characterize the defect or anomaly using a variety of electrical, optical, and physical techniques. Collaboration is expected with experts within the FA lab and other organizations, e.g., Design, Test, and Manufacturing. FA results will be documented in formal failure analysis reports. Analysis techniques will involve a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behaviour & reprocessing of the packaged device in order to identify the cause of failure. In addition many advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), EMMI and Laser Induced Electrical Stimulation tools (e.g. OBIRCH) are used in the investigation, isolation and identification of problems.
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 35 countries, over 45,000 employees and a revenue of over $10 billion.
- You will be employed by YER and seconded to NXP
- You have the possibility to earn a NXP contract after one year
- Good employee benefits (e.g. work-life balance, pension)
- Development opportunities, including the YER Talent Development Programme with a personal coach
- Intensive support for international candidates (including Dutch lessons, tax-return and accommodation assistance)
- Cooperative and results and relationship-driven
- Community/network with other technology professionals from a variety of multinationals
- Events and master classes with interesting speakers and attractive companies
- Engineering BS or MS degree aligned with Electric/Electronics or Applied Physics
- Good technical knowledge of digital and analog circuit fundamentals as well as an understanding of the underlying semiconductor device physics and behaviour
- Lab bench testing using evaluation boards, lab tester and electrical test data interpretation
- Understanding of semiconductor wafer processing
- Specific experience of microcontrollers and their operation would be an advantage
- Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc.
- Knowledge of UNIX, CADENCE and KNIGHTS software is desirable
- Ability to work with chemicals, X-Ray, Electron and Ion Beam Tools
The following job experiences would be a benefit/plus (but not required)
- Laboratory or wafer fab or similar manufacturing environment is a plus
- Microprobe measurement and analysis/test measurement knowledge
- Fault Isolation techniques, including liquid crystal, EMMI, OBIRCH, etc.
- Familiar with the FA process flow and analysis techniques: SEM, EDX, X-ray, etc.
- Ability to reprocess devices using a variety of wet and dry chemistry methodologies
- Strong problem solving skills, (e.g., 8D or similar practice) attention to detail, good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes